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| Obsolete Device TCM680 +5V To 10V Voltage Converter Features * 99% Voltage Conversion Efficiency * 85% Power Conversion Efficiency * Input Voltage Range: - +2.0V to +5.5V * Only 4 External Capacitors Required * 8-Pin SOIC Package General Description The TCM680 is a dual charge pump, voltage converter that produces output voltages of +2VIN and -2VIN from a single input voltage of +2.0V to +5.5V. Common applications include 10V from a single +5V logic supply and 6V from a +3V lithium battery. The TCM680 is packaged in 8-pin SOIC and PDIP packages and requires only four inexpensive, external capacitors. The charge pumps are clocked by an onboard 8 kHz oscillator. Low output source impedances (typically 140 ) provide maximum output currents of 10 mA for each output. Typical power conversion efficiency is 85%. High efficiency, small size and low cost make the TCM680 suitable for a wide variety of applications that need both positive and negative power supplies derived from a single input voltage. Applications * * * * * * * 10V From +5V Logic Supply 6V From a 3V Lithium Cell Handheld Instruments Portable Cellular Phones LCD Display Bias Generator Panel Meters Operational Amplifier Power Supplies Package Type PDIP Typical Operating Circuit +5V C1 + 4.7 F C1+ C1C2+ C2GND VOUTGND VOUT- = -(2 x VIN) C3 + 4.7 F VIN VOUT+ C4 + 4.7 F VOUT = (2 x VIN) + C1 C2+ C2 VOUT- 1 2 8 VOUT+ 7 C1 + TCM680CPA 3 TCM680EPA 6 VIN 4 5 GND TCM680 C2 + 4.7 F SOIC GND C1 C2+ C2 VOUT1 2 8 VOUT+ 7 C1 + TCM680COA 3 TCM680EOA 6 VIN 4 5 GND (c) 2005 Microchip Technology Inc. DS21486C-page 1 TCM680 1.0 ELECTRICAL CHARACTERISTICS Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability Absolute Maximum Ratings VIN .......................................................................+5.8V VOUT+ ................................................................ +11.6V VOUT- .................................................................-11.6V VOUT+ Short-Circuit Duration...................... Continuous VOUT+ Current ....................................................75 mA VIN dV/dT ....................................................... 1 V/sec Power Dissipation (TA 70C) 8-Pin PDIP ..............................................730 mW 8-Pin SOIC ..............................................470 mW Operating Temperature Range.............-40C to +85C Storage Temperature Range ..............-65C to +150C Maximum Junction Temperature ...................... +150C DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, VIN = +5V, TA = +25C, refer to Figure 1-1. Parameters Supply Voltage Range Supply Current Sym VIN IIN Min 2.0 -- -- -- -- Negative Charge Pump Output Source Resistance ROUT-- -- -- -- -- Positive Charge Pump Output Source Resistance ROUT+ -- -- -- -- Oscillator Frequency Power Efficiency Voltage Conversion Efficiency FOSC PEFF VOUTEFF -- -- 97 97 Typ -- 0.5 1.0 -- -- 140 180 -- -- -- 140 180 -- -- -- 21 85 99 99 Max 5.5 1.0 2.0 2.5 3.0 180 250 220 250 -- 180 250 220 250 -- -- -- -- -- kHz % % RL = 2 k VOUT+, RL = VOUT-, RL = Units V mA Conditions -40C TA +85C, RL = 2 k VIN = 3V, RL = VIN = 5V, RL = VIN = 5V, 0C TA +70C, RL = VIN = 5V, -40C TA +85C, RL = IL- = 10 mA, IL+ = 0 mA, VIN = 5V IL- = 5 mA, IL+ = 0 mA, VIN = 2.8V 0C TA + 70C -40C TA + 85C IL- = 10 mA, IL+ = 0 mA, VIN = 5V IL+= 10 mA, IL- = 0 mA, VIN = 5V IL+= 5 mA, IL- = 0 mA, VIN = 2.8V 0C TA + 70C -40C TA + 85C IL+ = 10 mA, IL- = 0 mA, VIN = 5V DS21486C-page 2 (c) 2005 Microchip Technology Inc. TCM680 VIN C1 + 4.7 F 1C1 2 C+ 2 4.7 F 3 C2 4 VOUTVOUT+ 8 C1+ 7 VIN 6 5 + C3 10 F GND RLVOUT+ C4 10 F VOUT+ C2 + TCM680 RL+ GND FIGURE 1-1: Test Circuit Used For DC Characteristics Table. (c) 2005 Microchip Technology Inc. DS21486C-page 3 TCM680 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, VIN = +5V, TA = +25C. 300 C1 = C4 = 10 F Output Resistance () 250 VOUT (V) 10.0 9.0 200 8.0 150 ROUT 100 1 2 3 VIN (V) 4 5 6 7.0 0 5 10 Load Current (mA) 15 FIGURE 2-1: Output Resistance vs. VIN. FIGURE 2-4: Current. 10.0 VOUT+ or VOUT- vs. Load 1.4 1.2 Supply Current (mA) 1.0 0.8 0.6 0.4 0.2 VOUT (V) 9.0 RL = 8.0 1 2 3 VIN (V) 4 5 6 7.0 0 6 8 4 2 Output Current (mA) From VOUT+ To VOUT- 10 FIGURE 2-2: Supply Current vs. VIN. FIGURE 2-5: Current. Output Voltage vs. Output 180 Output Source Resistance () IOUT = 10 mA 160 ROUT 140 120 100 -50 0 50 Temperature (C) 100 FIGURE 2-3: vs. Temperature. Output Source Resistance DS21486C-page 4 (c) 2005 Microchip Technology Inc. TCM680 3.0 PIN DESCRIPTION 3.4 Negative Output Voltage (VOUT-) The descriptions of the pins are listed in Table 3-1. Negative connection for the negative charge pump output capacitor. The negative charge pump output capacitor supplies the output load during the first, third and fourth phases of the switching cycle. During the second phase of the switching cycle, charge is restored to the negative charge pump output capacitor. The negative output voltage magnitude is approximately twice the input voltage. It is recommended that a low ESR (equivalent series resistance) capacitor be used. Additionally, larger values will lower the output ripple. TABLE 3-1: Pin No. (8-Pin PDIP, SOIC) 1 PIN FUNCTION TABLE Symbol C1Description Input. First charge pump capacitor. Negative connection Input. Second charge pump capacitor. Positive connection. Input. Second charge pump capacitor. Negative connection. Output. Negative Output voltage Input. Ground connection. Input. Power supply. Input. First charge pump capacitor. Positive connection. Output. Positive Output Voltage. 2 C2+ 3.5 Ground (GND) 3 C2- Input zero volt reference. 3.6 4 5 6 7 VOUTGND VIN C1+ Power Supply Input (VIN) Positive power supply input voltage connection. It is recommended that a low ESR (equivalent series resistance) capacitor be used to bypass the power supply input to ground (GND). 3.7 First Charge Pump Capacitor (C1+) 8 VOUT+ 3.1 First Charge Pump Capacitor (C1-) Positive connection for the charge pump capacitor (flying capacitor) used to transfer charge from the input source to a second charge pump capacitor. Proper orientation is imperative when using a polarized capacitor. Negative connection for the charge pump capacitor (flying capacitor) used to transfer charge from the input source to a second charge pump capacitor. This charge pump capacitor is used to double the input voltage and store the charge in the second charge pump capacitor. It is recommended that a low ESR (equivalent series resistance) capacitor be used. Additionally, larger values will lower the output resistance. 3.8 Positive Output Voltage (VOUT+) Positive connection for the positive charge pump output capacitor. The positive charge pump output capacitor supplies the output load during the first, second and third phases of the switching cycle. During the fourth phase of the switching cycle, charge is restored to the positive charge pump output capacitor. The positive output voltage magnitude is approximately twice the input voltage. It is recommended that a low ESR (equivalent series resistance) capacitor be used. Additionally, larger values will lower the output ripple. 3.2 Second Charge Pump Capacitor (C2+) Positive connection for the second charge pump capacitor (flying capacitor) used to transfer charge from the first charge pump capacitor to the output. It is recommended that a low ESR (equivalent series resistance) capacitor be used. Additionally, larger values will lower the output resistance. 3.3 Second Charge Pump Capacitor (C2-) Negative connection for the second charge pump capacitor (flying capacitor) used to transfer charge from the first charge pump capacitor to the output. Proper orientation is imperative when using a polarized capacitor. (c) 2005 Microchip Technology Inc. DS21486C-page 5 TCM680 4.0 4.1 DETAILED DESCRIPTION VOUT- Charge Storage - Phase 1 4.3 VOUT+ Charge Storage - Phase 3 The positive side of capacitors C1 and C2 are connected to +5V at the start of this phase. C1+ is then switched to ground and the charge in C1- is transferred to C2-. Since C2+ is connected to +5V, the voltage potential across capacitor C2 is now 10V. VIN = +5V - + SW1 + - C1 SW2 -5V + - C2 SW4 - + C3 SW3 C4 VOUT+ VOUT- The third phase of the clock is identical to the first phase - the charge stored in C1 produces -5V in the negative terminal of C1, which is applied to the negative side of capacitor C2. Since C2+ is at +5V, the voltage potential across C2 is 10V. VIN = +5V - + SW1 + - C1 SW2 -5V + - C2 SW4 - + C3 SW3 C4 VOUT+ VOUT- FIGURE 4-3: Charge Pump - Phase 1. Charge Pump - Phase 3. FIGURE 4-1: 4.4 VOUT+ Transfer - Phase 4 4.2 VOUT- Transfer - Phase 2 Phase two of the clock connects the negative terminal of C2 to the VOUT- storage capacitor C3 and the positive terminal of C2 to ground, transferring the generated -10V to C3. Simultaneously, the positive side of capacitor C1 is switched to +5V and the negative side is connected to ground. +5V - + SW1 + - C1 SW2 -5V + - C2 SW4 -10V - + C3 SW3 C4 VOUT+ VOUT- The fourth phase of the clock connects the negative terminal of C2 to ground and transfers the generated 10V across C2 to C4, the VOUT+ storage capacitor. Simultaneously, the positive side of capacitor C1 is switched to +5V and the negative side is connected to ground, and the cycle begins again. +5V - + SW1 + - C1 SW2 -5V SW3 + - SW4 -10V C2 - + C3 C4 VOUT+ VOUT- FIGURE 4-4: Charge Pump - Phase 4. FIGURE 4-2: Charge Pump - Phase 2. DS21486C-page 6 (c) 2005 Microchip Technology Inc. TCM680 4.5 Maximum Operating Limits The maximum input voltage rating must be observed. The TCM680 will clamp the input voltage to 5.8V. Exceeding this maximum threshold will cause excessive current to flow through the TCM680, potentially causing permanent damage to the device. 4.6 Switched Capacitor Converter Power Losses The overall power loss of a switched capacitor converter is affected by four factors: 1. Losses from power consumed by the internal oscillator, switch drive, etc. These losses will vary with input voltage, temperature and oscillator frequency. Conduction losses in the non-ideal switches. Losses due to the non-ideal nature of the external capacitors. Losses that occur during charge transfer from the pump to reservoir capacitors when a voltage difference between the capacitors exists. 2. 3. 4. The power loss for the TCM680 is calculated using the following equation: EQUATION PLOSS = (IOUT+)2 X ROUT- + (IOUT-)2 X ROUT+ + IIN X VIN (c) 2005 Microchip Technology Inc. DS21486C-page 7 TCM680 5.0 5.1 APPLICATIONS INFORMATION Voltage Multiplication and Inversion The TCM680 performs voltage multiplication and inversion simultaneously, providing positive and negative outputs (Figure 5-1). The magnitude of both outputs is, approximately, twice the input voltage. Unlike other switched capacitor converters, the TCM680 requires only four external capacitors to provide both functions simultaneously. C1 + 22 F + C2 22 F ROUT is typically 140 at +25C with VIN = +5V and C1 and C2 as 4.7 F low ESR capacitors. The fixed term (32RSW) is about 130. It can easily be seen that increasing or decreasing values of C1 and C2 will affect efficiency by changing ROUT. However, be careful about ESR. This term can quickly become dominant with large electrolytic capacitors. Table 5-1 shows ROUT for various values of C1 and C2 (assume 0.5 ESR). C1 and C4 must be rated at 6 VDC or greater while C2 and C3 must be rated at 12 VDC or greater. Output voltage ripple is affected by C3 and C4. Typically, the larger the value of C3 and C4, the less the ripple for a given load current. The formula for VRIPPLE(p-p) is given below: 1C 1 2 2 VOUT+ 8 C1+ 7 VIN GND 6 5 + C3 22 F + C4 22 F VOUT+ 2C + 3C 4 EQUATION VRIPPLE(p-p)+ = {1/[2(fPUMP /3) x C4] + 2(ESRC4)} (IOUT+) VRIPPLE(p-p)- = {1/[2(fPUMP /3) x C3] + 2(ESRC3)} (IOUT-) For a 10 F (0.5 ESR) capacitor for C3, C4, fPUMP = 21 kHz and IOUT = 10 mA, the peak-to-peak ripple voltage at the output will be less than 100 mV. In most applications (IOUT 10 mA), 10-20 F output capacitors and 1-5 F pump capacitors will suffice. Table 5-2 shows VRIPPLE for different values of C3 and C4 (assume 1 ESR). TCM680 VIN GND VOUT- VOUT- FIGURE 5-1: Converter. Positive and Negative 5.2 Capacitor Selection The TCM680 requires only 4 external capacitors for operation, which can be inexpensive, polarized aluminum electrolytic types. For the circuit in Figure 5-1, the output characteristics are largely determined by the external capacitors. An expression for ROUT can be derived as shown below: TABLE 5-1: C1, C2 (F) 0.1 0.47 1 3.3 4.7 10 22 100 OUTPUT RESISTANCE VS. C1, C2 ROUT+, ROUT- () 1089 339 232 165 157 146 141 137 EQUATION ROUT+ = 4(RSW1 + RSW2 + ESRC1 + RSW3 + RSW4 + ESRC2) +4(RSW1 + RSW2 + ESRC1 + RSW3 + RSW4 + ESRC2) +1/(fPUMP x C1) + 1/(fPUMP x C2) + ESRC4 ROUT- = 4(RSW1 + RSW2 + ESRC1 + RSW3 + RSW4 + ESRC2) +4(RSW1 + RSW2 + ESRC1 + RSW3 + RSW4 + ESRC2) +1/(fPUMP x C1) + 1/(fPUMP x C2) + ESRC3 TABLE 5-2: C3, C4 (F) 0.47 1 3.3 4.7 10 22 100 VRIPPLE PEAK-TO-PEAK VS. C3, C4 (IOUT 10 mA) VRIPPLE(p-p)+,VRIPPLE(p-p)- (mV) 1540 734 236 172 91 52 27 Assuming all switch resistances are approximately equal: EQUATION ROUT+ = 32RSW + 8ESRC1 + 8ESRC2 + ESRC4 +1/(fPUMP x C1) + 1/(fPUMP x C2) ROUT- = 32RSW + 8ESRC1 + 8ESRC2 + ESRC3 +1/(fPUMP x C1) + 1/(fPUMP x C2) DS21486C-page 8 (c) 2005 Microchip Technology Inc. TCM680 5.3 Paralleling Devices 5.4 Output Voltage Regulation To reduce the value of ROUT- and ROUT+, multiple TCM680 voltage converters can be connected in parallel (Figure 5-2). The output resistance of both outputs will be reduced, approximately, by a factor of n, where n is the number of devices connected in parallel. The outputs of the TCM680 can be regulated to provide +5V from a 3V input source (Figure 5-3). The TCM680 performs voltage multiplication and inversion producing output voltages of, approximately, +6V. The TCM680 outputs are regulated to +5V with the linear regulators TC55 and TC59. The TC54 is a voltage detector providing an indication that the input source is low and that the outputs may fall out of regulation. The input source to the TCM680 can vary from 2.8V to 5.5V without adversely affecting the output regulation making this application well suited for use with single cell Li-Ion batteries or three alkaline or nickel based batteries connected in series. EQUATION ROUT- = ROUT- (of TCM680) n (number of devices) EQUATION ROUT+ = ROUT+ (of TCM680) n (number of devices) Each device requires its own pump capacitors, but all devices may share the same reservoir capacitors. To preserve ripple performance, the value of the reservoir capacitors should be scaled according to the number of devices connected in parallel. VIN - 22 F + + 10 F - C1+ VIN C1 C2 - VOUT+ + 10 F - C1+ VIN C1 - VOUT+ Positive Supply TCM680 + TCM680 + 10 F - C2+ - + 10 F - C2 GNDVOUT - VOUT- 22 F + Negative Supply C2 GND GND FIGURE 5-2: Paralleling TCM680 for Lower Output Source Resistance. (c) 2005 Microchip Technology Inc. DS21486C-page 9 TCM680 + - C1 + C1 TCM680 + 10 F - C2 + COUT+ 22 F TC55RP5002EXX VIN VSS VOUT + - 1 F Ground + VSS - VOUT 1 F -5 Supply +5 Supply VIN +6V + 10 F - + - 3V C2 - VOUTGND -6V VIN - + COUT22 F TC595002ECB TC54VC2702Exx VIN VSS VOUT LOW BATTERY FIGURE 5-3: Split Supply Derived from 3V Battery. DS21486C-page 10 (c) 2005 Microchip Technology Inc. TCM680 6.0 6.1 PACKAGING INFORMATION Packaging Marking Information 8-Lead PDIP (300 mil) Example: XXXXXXXX XXXXXNNN YYWW TCM680 CPA123 0231 8-Lead SOIC (150 mil) Example: XXXXXXXX XXXXYYWW NNN TCM680 COA0231 123 Legend: XX...X YY WW NNN Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. (c) 2005 Microchip Technology Inc. DS21486C-page 11 TCM680 8-Lead Plastic Dual In-line (P) - 300 mil (PDIP) E1 D 2 n 1 E A A2 c L A1 eB B1 p B Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D L c B1 B eB MIN INCHES* NOM 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10 MAX MIN .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 .170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 DS21486C-page 12 (c) 2005 Microchip Technology Inc. TCM680 8-Lead Plastic Small Outline (SN) - Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h 45 c A A2 L A1 Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D h L c B MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX MIN .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 (c) 2005 Microchip Technology Inc. DS21486C-page 13 TCM680 NOTES: DS21486C-page 14 (c) 2005 Microchip Technology Inc. TCM680 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range /XX Package Examples: a) b) Device: TCM680: Charge Pump Converter TCM680COA: Charge Pump Converter, SOIC pkg, 0C to +70C. TCM680COATR: Charge Pump Converter, SOIC pkg, 0C to +70C, Tape and Reel. c) d) e) TCM680CPA: Charge Pump Converter, PDIP pkg, 0C to +70C. TCM680EOA: Charge Pump Converter, SOIC pkg, -40C to +85C. TCM680EOATR: Charge Pump Converter, SOIC pkg, -40C to +85C, Tape and Reel. Temperature Range: C E = 0C to +70C = -40C to +85C Package: PA = Plastic DIP (300 mil Body), 8-lead OA = Plastic SOIC, (150 mil Body), 8-lead OATR = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) f) TCM680EPA: Charge Pump Converter, PDIP pkg, -40C to +85C. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. (c) 2005 Microchip Technology Inc. DS21486C-page15 TCM680 NOTES: DS21486C-page 16 (c) 2005 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. (c) 2005 Microchip Technology Inc. DS21486C-page 17 WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 San Jose Mountain View, CA Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8676-6200 Fax: 86-28-8676-6599 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7250 Fax: 86-29-8833-7256 ASIA/PACIFIC India - Bangalore Tel: 91-80-2229-0061 Fax: 91-80-2229-0062 India - New Delhi Tel: 91-11-5160-8631 Fax: 91-11-5160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Gumi Tel: 82-54-473-4301 Fax: 82-54-473-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 10/31/05 DS21486C-page 18 (c) 2005 Microchip Technology Inc. |
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